SEMIgear is currently developing thermal processing equipment for the semiconductor industry. Our first product,
the GENEVA Serial Thermal Processor(STP) 200 is a versatile heat treating platform designed for low temperature
(<=650C) applications. It is the first thermal processing tool to employ changeable configuration to allow for
specific applications and easy upgrade to match the process advance in the new generation of semiconductor nodes.
GENEVA STP can accommodate different heating modules for a variety of process applications. The heating methods
include contact heating, close proximity heating, radiation heating, and vacuum heating depending on the modules
adapted into the system. Fully automated with cassette-to-cassette wafer loading and a tight ambient controlled
loadlock, it is best suited for shorter time-at-temperature applications such as solder reflow, metal anneal,
silicide formation, low k dielectric material anneal, and others. It has a very high throughput for processes
requiring time-at-temperature shorter than 10 minutes.
There are three important steps in traditional wafer level packaging: dispensing flux, reflow solder, and washing
flux residues. GENEVA STP uses advanced no-flux processing to combine these three steps into one. The end result
is a fully automated solution with much smaller footprint and lower cost.
SEMIgear is presently targeting two different applications with the GENEVA STP. The first, solder reflow, is used
for flip-chip packaging applications. The reflow process and conditions are essential for generating smooth,
spherical solder bumps with minimum void content. This operation allows the solder balls to be formed on the
semiconductor chips with no oxide, little segregation of tin/lead, and minimum inter-metallic compound formation.
The second application is the copper/low k annealing. This is the new process for technology nodes of 0.13um or
smaller. The ambient control and vacuum capability are most essential in this application.
SEMIgear has since developed systems to handle both the 200mm and 300mm wafters for solder reflow,copper anneal,
and low-k curling application. The GENEVA STP200 is designed for processing 125, 150, 200mm wafers. The GENEVA
STP300 is fundamentally a scaled-up version of the GENEVA STP200, capable of processing both 200mm and 300mm
wafers with more additional automation features. With automation, superior ambient control, and fast ramp rates,
SEMIgear GENEVA STP can achieve high throughput with excellent results. It is the tool of choice when competing
with belt furnaces and rapid furnaces in the semiconductor solder reflow application and tube furnaces in the
copper/low k anneal applciation.
GENEVA STP200 (Serial Thermal Processor for 125mm, 150mm, and 200mm wafers)
GENEVA STP300 (Serial Thermal Processor for 200mm and 300mm wafers)