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We have assembled a group of scientists and engineers with more than 50 years of combined knowledge and experience in areas of advanced material processing and various semiconductor industries such as Ion implantation, Dry etch, CVD, PVD, Thermal anneal, Metal anneal, and Solder reflow. We are devoted to the design, development, and manufacturing of semiconductor wafer processing and packaging equipment. Since the establishment of the company in January of 2002, we have achieved the following milestones:

• We kicked-off the GENEVA Serial Thermal Processor (STP) project in February of 2002.


• We showcased the fully automated GENEVA STP-200 (for 200mm wafers) in SEMICON West 2002.


• We successfully demonstrated the wafer processing capabilities in August of 2002.


• We shipped the first production GENEVA STP-200 to a wafer packaging company in Taiwan in October of 2002.


• We kicked-off the GENEVA STP-300 for 300mm wafers in November of 2002.


• We successfully completed the 300mm line in March of 2003.


• We successfully demonstrated the wafer processing capabilities in May of 2003.

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